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TRI AOI

TR7700QE

上視相机: 12 MP 相机
照明光源: 多相位全彩LED灯源,同轴光
3D光源  :四光源数位条纹光
X-Y-Z 轴解析度: 1 μm
电路板可测厚度:0.6 - 5 mm
电路板流线高度:880 - 920 mm
电路板最大重量:3 kg
电路板输送 / 固定:马达自动控制进出
    The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programming and features fully customizable templates.
    Features:
    • Advanced 2D + 3D Coverage
    • 4-way Digital Fringe Projectors
    • Up to 40 mm 3D Height Range
    • High Speed CoaXPress Imaging
    • Optional 3D Laser Module
    Please submit your basic information, we will contact you as soon as possible!

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